BA392E SMT Pick & Place Machine
FEATURES
- Using welded steel frame and also heavy duty high precision Linear Ball Rail system to provide strong, rigid and long life time mechanism.
- Features COGNEX® vision processing and head-mounted for non-contact “Vision on the Fly” alignment. The machine BA392 assures high-precision placement of the full range of SMDs components.
- A Bottom Vision Camera is used for large components up to 150 x 100 mm and devices with alignment features on their bottom side.
- Beside the standard fiducial mark, either square SMD PCB pad or plate-through hole also can be trained as fiducial mark.
- Innovative two-stage conveyor design that handles 600mm board length in each stage, hence supports long PCB of 1.2m total length in automatic production.
- TEFLON made LED nozzle in Autotronik BA392 machine, together with the positive air outputting pressure, is specialized design for LED application. The innovative design of Nozzle ensures the effective landing of sticky LED components.
- Intelligent software allows the easy set up for the complex and repeatable LED programming.
SUMMARY
High Accuracy and high Flexibility for
- 0201 (0.6mmX0.3mm)
- SOIC, PLCC
- BGA, μBGA,CSP
- QFP (up to fine-pitch 0.3mm)
COGNEX® Alignment System “Vision on the Fly”
Smart Feeder System provides Automatic feeder position checking,Automatic component counting, Production data Traceability
Perfect for small volume production
Bottom Vision Alignment System for fine pitch QFP & BGA
Built in Camera System with Auto Smart Fiducial Mark Learning
Unique Dual Stage conveyor for 1.2m LED board application
Dispenser System (option)
Universal CAD Conversion
Windows XP Software
SPECIFICATION
Number of Heads (Vision on the Fly) : | 1 / 2 |
Placement rate : |
392E1: 4500 cph(under the optimum condition), 4000 cph(IPC9850 Chip 1608) 392E2: 6400 cph(under the optimum condition), 5500 cph(IPC9850 Chip 1608) |
Feeder capacity (8 mm) without conveyor : | up to 160 Tape Feeders |
Feeder capacity (8 mm) with conveyor : | up to 96 Tape Feeder |
IC Tray capacity : |
up to 4 Waffle Trays up to 10 Waffle tray with TH-14 Tray Handler (option) |
Component Size : |
Handled by head camera :- Smallest: 0.6 x 0.3 mm - Largest: 16 x 14 mmHandled by fixed Bottom Vision Camera :- Smallest: 0.4 x 0.2 mm (option) - Largest: 150 x 100 mm (option) |
Resolution : |
X / Y axis 0.005 mm Servo Motor Z axis 0.02 mm Servo Motor |
Rotation : | 0 to 360° (0.045°/step) Servo Motor |
Placement Accuracy : |
+/-0.05mm ( Chip components) +/-0.03mm (QFP , uBGA) |
X-Y Repeatability : | +/- 0.01 mm |
Placement area w/o conveyor : |
Max. 600 x 350 mm without Waffle Trays Max. 600 x 330 mm with 1 Waffle Tray Max. 600 x 190 mm with 2 Waffle Trays |
Placement area w/ conveyor : |
Max. 650 x 315 mm without Waffle Trays Max. 650 x 300 mm with 1 Waffle Tray Max. 650 x 160 mm with 2 Waffle Trays |
Programming : | Direct input, Vision teach-in, CAD Access (Option) |
Component Sense : | Vision detection |
Machine Size: | 1190 x 1180 x 1730 mm (W x D x H) |
Weight : | 740kg |
Power : | 220 V / AC, 2400 W |
Pressure : | 75 psi (5.5 bar), 200L/min |
* We reserve the right to make changes without notice.