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- Real time temperature profile display
- Android system on multi-core CPU platform
- 7" touch screen high resolution LCD display
- Compact design ideal for labs, schools, prototyping and low-volume job shops
- WiFi temperature profile printing and data storage
- Real time close loop PID temperature control for leadfree profile
- Quick Smart programming by rising rate control (degree change per second)
- Infrared and forced convection combine for efficient lead-free reflow Features
PRODUCT INFO
BT302 Bench-top / Batch Reflow Oven Dynamic Thermal Profile using a Batch Reflow Oven with Android™ Operating System Match your thermal process specifications for preheat, soak, reflow, and cooling on the first PCB you produce with by using revolutionary new BT302 Batch Reflow Oven. Having the thermal conditions of an inline reflow system in a bench-top unit with a full dynamic thermal process. |
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Full hot-air soldering processing |
SPECIFICATION
Applicable solder types : | Lead-Free and Leaded |
PCB holding size : | 340 mm x 240 mm |
PCB effective heating area : | 320 mm x 220 mm |
Heating method : | Full Hot Air Convection |
Temperature range : | Ambient - 280 °C |
Temperature control method : | Real time close loop PID temperature control for lead free profile |
Computer control : | Build-in dual core CPU on board computer |
Display panel : | 7" touch screen high resolution LCD display |
Temperature control setting : |
Quick smart profile programming by temperature rising rate control (degree change per second) |
Temperature profile display : | Real time temperature profile display |
Temp profile printing : | WiFi temperature profile printing |
Storage : | External data storage via WiFi connection |
Electrical : (three phase power) |
220V, Single Phase,50/60 Hz,35A(BT302) 380V,Three Phase,50/60 Hz(BT302P) |
Power : | 8400W |
Dimensions : | 770 mm L x 700 mm W x 480 mm H |
Weight : | approx. 125 Kg |
* We reserve the right to make changes without notice.